This text covers the key technologies employed in wireless links that enable increased data rates and thus are likely to be employed in support of 5G wireless transport networks, i.e., backhaul, midhaul, and fronthaul networks. The author presents technologies at an introductory level but nonetheless at a level that imparts to the reader a sound understanding of the fundamentals. The book is intended for those practicing engineers and graduate and upper undergraduate students who have an interest in acquiring, where missing, the necessary technology background in order to comprehend the functioning and capability of 5G based wireless transport links. The author focuses on those technologies that are key to achieving the high data rates and high reliability required of this transport. The material is presented in a clear, concise, and mathematically light fashion.

• Covers key wireless transport (backhaul, midhaul, and fronthaul) technologies for 5G and beyond, presented in a clear tractable fashion;
• Outlines the basic wireless transport transmitter/receiver terminal architecture, provides specifications of some such terminals, and indicates the link performance afforded by such terminals;
• Provides sufficient mathematics to make it technically coherent, but not so much as to make it challenging for a reader with no or limited familiarity with these technologies.

Table of Contents

Chapter 1: SG Architecture and the Roll of Wireless Transport

Chapter 2: SG Transport Payload: Ethernet-Based Packet-Switched Data

Chapter 3: The Fixed Wireless Path

Chapter 4: Digital Modulation: The Basic Principles

Chapter 5: Performance Optimization Techniques

Chapter 6: Non-Modulation-Based Capacity Improvement Techniques

Chapter 7: Transceiver Architecture, Link Capacity, and Example Specifications

About the Author

Dr. Douglas H. Morais received a PhD from the University of Ottawa, Ontario, Canada,an M.Sc from the University of California, Berkeley, California, and a B.Sc from the University of Edinburgh, Scotland, all in Electrical Engineering. He is a graduate of theAEA/Stanford Executive Institute, Stanford University, California. After decades in industry he is currently an, author and short course lecturer.. Previously, he was President of the Wireless Group at Ortel Corporation and both Executive Vice President, Business Development and Technology and President, Wireless Products Group at California Microwave, Inc. He is the author of “Fixed Broadband Wireless Communications,” Pearson Education, Inc., 2004 and “Key 5G Physical Layer Technologies,” Springer Nature Switzerland AG, 2020. He holds three US patents, including “Hard and Soft Bit Demapping for QAM Non-Square Constellations”, “Quadrature Amplitude Modulation via Modified-Square Signal Point Constellation,” and “Radio Communication System Using Frequency Division Multiplexing for Transmission Between a Master Station and a Plurality of Remote Stations,”. He is a Life Senior Member of the IEEE, and a member of the IEEE Communications Society.